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Type:whitepaper

13 Jan 25

Dual Seal Method for the Hermetic Sealing of Microbatteries

The hermetic sealing of microbatteries is critical to ensuring the long-term performance, safety, and reliability within the many electronics they are used. This white paper explores the essential properties and performance criteria of those adhesives designed for hermetically sealing batteries. The adhesive must fulfill several critical criteria, such as chemical…
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07 Jan 25

Ensuring the Security and Resilience of Autonomous Fleets with Advanced Testing Frameworks

Autonomous systems, particularly fleets of drones and other unmanned vehicles, face increasing risks as their complexity grows. Despite advancements, existing testing frameworks fall short in addressing end-to-end security, resilience, and safety in zero-trust environments. The Secure Systems Research Center (SSRC) at TII has developed a rigorous, holistic testing framework to…
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03 Jan 25

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Multi-die designs using 2.5D and 3D technologies are increasingly important for a wide range of electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile. The multi-die architecture enables designers to mix dies from different foundries and technology nodes, including existing dies from previous projects. The resulting density…
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16 Dec 24

Unlock the Power of Agile for Hardware Teams

The Modified Agile for Hardware Development (MAHD) Framework is the ultimate solution for hardware teams seeking the benefits of Agile without the pitfalls of applying software-centric methods. Traditional development approaches, like waterfall, often result in delayed timelines, high risks, and misaligned priorities. Meanwhile, software-based Agile frameworks fail to account for…
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06 Dec 24

Conquer 3DIC thermal impacts with Calibre 3DThermal

The Calibre 3DThermal tool lets designers perform accurate chip and package-level static or dynamic thermal analysis of the full 3D IC assembly. It combines a customized solver engine from the industry-leading 3D package-level thermal analysis tool, Simcenter Flotherm, and the proven Calibre physical verification platform to perform highly accurate and…
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08 Nov 24

Revolutionizing Software Supply Chain Security: A Holistic Approach

Despite significant investments, software supply chains remain vulnerable, evidenced by breaches affecting major enterprises. The Security Systems Research Center (SSRC) at the Technology Innovation Institute (TII) is pioneering new tools and frameworks to secure the entire software supply chain. From Software Bill of Materials (SBOM) generation and vulnerability management automation…
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Peek into the Future of A&D with Ansys

Across industries, autonomous technology is driving innovation at a rapid pace. This is especially true in the aerospace and defense (A&D) industry, where autonomous technology can potentially be used for everything from conducting search and rescue missions in dangerous conditions via unmanned aerial vehicles (UAVs) to transporting passengers in busy…
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