3d integration

27 Jun 23

What AMD Learned From Its Big Chiplet Push

Electrical, Electronics & Instrumentation, Metallurgy & Material Science

Over the last five years, processors have gone from being single pieces of silicon to a collection of smaller chiplets that collectively act as if they’re one big chip. This approach means that the CPU’s functional pieces can be built using the technology that suits each piece best. Sam Naffziger,…

24 May 23

Keeping Moore’s Law Going is Getting Complicated

Electrical, Electronics & Instrumentation, Mechanical, Production & Manufacturing

There was a time, decades really, when all it took to make a better computer chip were smaller transistors and narrower interconnects. That time’s long gone now, and although transistors will continue to get a bit smaller, simply making them so is no longer the point. The only way to…

21 Feb 23

AMD CEO: The Next Challenge Is Energy Efficiency

Computer & Information Technology

“Over the next decade, we must think of energy efficiency as the most important challenge,” Lisa Su, CEO of Advanced Micro Devices, told engineers at the 2023 IEEE International Solid State Circuits Conference (ISSCC), in San Francisco.Despite a slowdown of Moore’s Law, other factors have pushed mainstream computing capabilities to…

05 Dec 22

Intel’s Take on the Next Wave of Moore’s Law

Electrical, Electronics & Instrumentation, Metallurgy & Material Science

The next wave of Moore’s Law will rely on a developing concept called system technology co-optimization, said Ann B. Kelleher, general manager of technology development at Intel in an interview with IEEE Spectrum ahead of her plenary talk at the 2022 IEEE Electron Device Meeting (IEDM).“Moore’s Law is about increasing…