ENGGtalks Newsroom

29 Dec 22

Plastic Rad-Hard Package Offers a Smaller and More Thermally Efficient Alternative to QMLV

Aerospace & Aeronautical

TI has developed a new device screening specification called space high grade in plastic (SHP) for space-qualified devices constructed in plastic packaging traditionally used in industrial applications. SHP includes both plastic substrate ball-grid array (BGA) and plastic-encapsulated packages. The SHP qualification level produces devices suitable for tough mission profiles typically…

27 Dec 22

GFA Production (Xiamen) Co., Ltd. Issues Voluntary Nationwide Recall of Easy Care First Aid® Burn Cream and First Aid Kits Due to Microbial Contamination

Biotechnology & Biomedical

Audience: Patient, Health Professional, Pharmacy December 23, 2022 – Xiamen, Fujian, GFA Production (Xiamen) Co., Ltd. is voluntarily recalling one lot of Easy Care first aid® AfterBurn ® Cream, 0.9 g single-use packets. The single use...

27 Dec 22

Hospira, Inc. Issues A Voluntary Nationwide Recall For One Lot of Vancomycin Hydrochloride Injection, USP 1.5g/vial, Due To The Presence of Visible Glass Particulates

Biotechnology & Biomedical

Audience: Health Professional, Pharmacy December 22, 2022 - NEW YORK, NY., Hospira, Inc., a Pfizer company, is voluntarily recalling one lot of Vancomycin Hydrochloride Injection, USP, 1.5 g/vial Single Dose Fliptop Vial, lot 33045BA, to the user...

26 Dec 22

A New Treatment for Arthritis: Vagus-Nerve Stimulation

Biotechnology & Biomedical

Monique Robroek once had such crippling arthritis that, even with the best available medications, she struggled to walk across a room. But thanks to an electronic implant fitted under her skin, she managed to wean herself off all her drugs and live pain-free for nearly a decade—until recently, when a…

22 Dec 22

How to Use Adhesives for Your MEMs Packaging

Electrical, Electronics & Instrumentation, Metallurgy & Material Science

Does your MEMs packaging application have specific requirements? Epoxy adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, and other physical damage. These systems can be ideal for die attach, underfill and encapsulation.

21 Dec 22

Wi-Fi routers could be used to monitor breathing

Electrical, Electronics & Instrumentation

Scientists at the US National Institute of Standards and Technology (NIST) have created BreatheSmart, an algorithm to determine whether someone is having trouble breathing using available Wi-Fi routers and devices. Wi-Fi routers continuously broadcast radio frequencies that phones, tablets and computers are able pick up. As the signals travel, they bounce…

20 Dec 22

Biomimicry innovations set to transform urban construction

Geotechnical & Environmental

The Ray of Hope Prize from the US Biomimicry Institute is an annual programme that supports the top nature-inspired start-ups whose innovations have the potential to solve critical environmental and social issues. Among the 2022 finalists are two organisations with innovations that can transform urban construction, Mycocyle and Metavoxel, which…

16 Dec 22

Where now for the transistor?

Electrical, Electronics & Instrumentation

The transistor celebrated its 75th birthday on Friday (16 December), just at the point where its future is in doubt, or at least its role in the future scaling of the chips that use this now ubiquitous device. Depending on who you ask, Moore’s Law is in various states of…

12 Dec 22

Self-Powered Electronic Pill Monitors Gut Chemistry

Biotechnology & Biomedical

A battery-free electronic pill that can help doctors wirelessly analyze molecules generated during vital bodily chemical reactions in the gut has been demonstrated for the first time, say the researchers behind a new study. The team of engineers, from the University of California at San Diego (UCSD), detailed their findings…

11 Dec 22

Two Startups Are Bringing Fiber to the Processor

Electrical, Electronics & Instrumentation, Metallurgy & Material Science

If a CPU in Seoul sends a byte of data to a processor in Prague, the information covers most of the distance as light, zipping along with no resistance. But put both those processors on the same motherboard, and they’ll need to communicate over energy-sapping copper, which slow the communication…