ENGGtalks Newsroom

Plastic Rad-Hard Package Offers a Smaller and More Thermally Efficient Alternative to QMLV

TI has developed a new device screening specification called space high grade in plastic (SHP) for space-qualified devices constructed in plastic packaging traditionally used in industrial applications. SHP includes both plastic substrate ball-grid array (BGA) and plastic-encapsulated packages. The SHP qualification level produces devices suitable for tough mission profiles typically…
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